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Inviato - 22/11/2021 : 15:08:40
Parameter
Layers: 10L
Material: RO4003C + IT180A
Board Thicknes: 2.3 mm
Copper Thicknes: 35/18/18/35 um
Line/Space: 3.5/4 mil (inner layer)
Smallest Hole Diameter: 0.15mm
Surface Treatment: ENIG(2U'')
Technical Feature:
Blind/Buride Via Holes; VIPPO; 10% Impedance control
Applications
Communication base station
Special Note:
More Technologies Limited has strong manufacturing capabilities and high-quality products and services. This is a 10-layer high-frequency mixed-pressing board with Blind/Buride Via Holes, Impedance control. The regular delivery time is 13 days, and the fastest delivery can be achieved in 8 days.
Exquisite craftsmanship to meet the needs of printed circuit boards for communication: (1) Mature mixing technology: FR4+PTFE, FR4+408HR, FR4+ROGERS, ceramic+FR4; (2) 3mil/3mil line width line spacing, impedance tolerance can be controlled at ±7%.
Eight applications of High Frequency PCB:
1. Digital Audio Broadcasting(DAB, Filters, Combiners)
2. Broadband RF Antennas (Satellite Radio, Power Amplifiers, WIFI/WiMax, RFID)
3. Military Electronics (Radars Manifolds and Feed Networks, ESM, Guidance)
4. Microwave RF Components (Filters, Directional Couplers, TXRX, Up/Down converters)
5. Satellite Signal transmission equipment.(LNAs, LNBs,GPS)
6. High frequency wireless communication
7. Missile Guidance Systems
8. Commercial Phased Array Networks
If you have such products or designs, please contact us. More Technologies Limited is happy to provide you with free technical advice and design suggestions.
https://www.rogerspcb.com/buried-blind-via-pcb/hybrid-pcb-board.html |
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